Position:
HBM Assembly Process Engineer at Micron Technology
Location:
Taichung–Changhua Metropolitan Area, Taiwan
Found email addresses for Ryan Jiang:
Found phone for Ryan Jiang:
Apr 2025 - Current
Dec 2024 - Apr 2025
Sep 2018 - Dec 2024
Sep 2017 - Sep 2018
Their professional focus is Cross-functional Collaborations, Customer communication, and Die Attach across 3 core areas.
碩士 at 國立虎尾科技大學
學士 at 國立虎尾科技大學
What is Ryan Jiang's email address?
SignalHire found a verified business email address for Ryan Jiang: j**@micron.com.What is Ryan Jiang's phone number?
SignalHire found a verified phone number for Ryan Jiang: +886-***-***-3153.How do I contact Ryan Jiang at Micron Technology?
You can reach Ryan Jiang through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.What is Ryan Jiang's professional background?
Ryan Jiang has 9 years of professional experience. They have held roles including FOPLP Technical Development Principal Engineer, 製程工程師, and 客戶工程師 at companies such as INNOLUX群創光電, 南茂科技股份有限公司, and Chipbond Technology Corporation.. Their education includes 碩士 from 國立虎尾科技大學, and 學士 from 國立虎尾科技大學.Is Ryan Jiang's contact information up to date?
Yes. Ryan Jiang's SignalHire profile was last updated on 15 April 2026, reflecting their current position as HBM Assembly Process Engineer at Micron Technology in Boise, Idaho, United States.SignalHire complies with the General Data Protection Regulation (GDPR). SignalHire follows GDPR requirements, including but not limited to rights of data subjects to access, correct, or delete their personal information and supports the right to be forgotten.
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