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Senior Package R&D Engineer,Silicon Photonics Packaging at Intel|Kaohsiung City, Kaohsiung City, Taiwan

Position:

Senior Package R&D Engineer,Silicon Photonics Packaging at Intel

Location:

Kaohsiung City, Kaohsiung City, Taiwan

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Last updated: 2025-09-29
Updated: 2025-09-29

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Work Experience 22 years

Senior Package R&D Engineer,Silicon Photonics Packaging at Intel

Jun 2018 - Current

NTI Project Leader at NXP Semiconductors

Jul 2017 - May 2018

Europe Region Customer Engineering Intergration supervisor at ASE Global

Oct 2010 - Jul 2017

Bumping Product Engineer at ASE Global

Mar 2004 - Oct 2010

Martin started working in 2004, then the employee has changed 2 companies and 3 jobs. On average, Martin works for one company for 5 years 6 months.

Frequently Asked Questions

What is Martin's minimum period of employment in the companies?

Martin's minimum period of employment in various companies is 10 months.

What is Martin's average duration of employment for different companies?

On average, Martin works for one company for 4 years 9 months

What industries has Martin worked in?

Martin works in the Semiconductors.

What positions has Martin held before?

Previously, Martin worked as a NTI Project Leader, and Europe Region Customer Engineering Intergration supervisor, and Bumping Product Engineer.

How do I contact Martin?

Martin's phone number is +886-***-***-6442. Sign up to get contact details.

Who is the CEO of the Intel?

The CEO of the Intel is Patrick P. Gelsinger

Martin Namesakes

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COMPTECHM
Computer Technical Specialist

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