Leonardo Lanni

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Mechanical Systems Intern at Polymathic Innovations|New York City Metropolitan Area, United States

Position:

Mechanical Systems Intern at Polymathic Innovations

Location:

New York City Metropolitan Area, United States

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Last updated: 2026-04-21
Updated: 2026-04-21

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Work Experience 4 years

Mechanical Systems Intern at Polymathic Innovations

Feb 2026 - Current

Physics Undergraduate Teaching Assistant at Rensselaer Polytechnic Institute

Sep 2025 - Current

Student Ambassador at Rensselaer Polytechnic Institute

Jan 2025 - Current

Project Manager at MainStreamPhotoBooth

Jun 2022 - Current

Team Lead Manager at The Fuller Center for Housing

Feb 2024 - May 2024

Leonardo Lanni started working in 2022, then the employee has changed 3 companies and 4 jobs. On average, Leonardo Lanni works for one company for 1 year 3 months.

Education

Bachelor of Engineering at Rensselaer Polytechnic Institute

High School Diploma at Regis High School

Frequently Asked Questions

What is Leonardo Lanni's email address?

SignalHire found a verified business email address for Leonardo Lanni: l*****i@polymath-ic-innovations.com.

What is Leonardo Lanni's phone number?

SignalHire found a verified phone number for Leonardo Lanni: +1-***-***-1877.

How do I contact Leonardo Lanni at Polymathic Innovations?

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What is Leonardo Lanni's professional background?

Leonardo Lanni has 4 years of professional experience. They have held roles including Physics Undergraduate Teaching Assistant, Student Ambassador, and Project Manager at companies such as Rensselaer Polytechnic Institute, Rensselaer Polytechnic Institute, and MainStreamPhotoBooth. Their education includes Bachelor of Engineering from Rensselaer Polytechnic Institute, and High School Diploma from Regis High School.

Is Leonardo Lanni's contact information up to date?

Yes. Leonardo Lanni's SignalHire profile was last updated on 21 April 2026, reflecting their current position as Mechanical Systems Intern at Polymathic Innovations in Troy, New York, United States.

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