Keyvan Zhang

Keyvan Zhang: Email & Phone Number

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Corp Vice President, World Wide Memory Manufacturing Group at Intel|United States

Position:

Corp Vice President, World Wide Memory Manufacturing Group at Intel

Location:

United States

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Last updated: 2023-04-11
Updated: 2023-04-11

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Work Experience 21 years

Corp Vice President, World Wide Memory Manufacturing Group at Intel

Jan 2016 - Current

TMG VP, IMFT Joint Venture Co-CEO at Intel

Jan 2010 - Jan 2016

GM/Director California Tech Development & Mfg at Intel

Jan 2007 - Jan 2009

D2 Plant manager at Intel

Jan 2005 - Jan 2007

Keyvan Zhang started working in 2005, then the employee has changed 3 jobs. On average, Keyvan Zhang works for one company for 5 years 1 month.

Education

School of Business at Stanford University

Master of Science - MS at Purdue University

Frequently Asked Questions

What is Keyvan Zhang's email address?

SignalHire found a verified business email address for Keyvan Zhang: z*********n@intel.com.

What is Keyvan Zhang's phone number?

SignalHire found a verified phone number for Keyvan Zhang: +1-***-***-1252.

How do I contact Keyvan Zhang at Intel?

You can reach Keyvan Zhang through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.

What is Keyvan Zhang's professional background?

Keyvan Zhang has 21 years of professional experience. They have held roles including TMG VP, IMFT Joint Venture Co-CEO, GM/Director California Tech Development & Mfg, and D2 Plant manager at companies such as Intel, Intel, and Intel. Their education includes School of Business from Stanford University, and Master of Science - MS from Purdue University.

Is Keyvan Zhang's contact information up to date?

Yes. Keyvan Zhang's SignalHire profile was last updated on 11 April 2023, reflecting their current position as Corp Vice President, World Wide Memory Manufacturing Group at Intel in Santa Clara, California, United States.

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