Jasper

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Senior Equipment Development Engineer (NAND - Hybrid Bonding and CMP) at Micron Technology|Singapore

Position:

Senior Equipment Development Engineer (NAND - Hybrid Bonding and CMP) at Micron Technology

Location:

Singapore

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Last updated: 2026-06-04
Updated: 2026-06-04

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Work Experience 13 years

Senior Equipment Development Engineer (NAND - Hybrid Bonding and CMP) at Micron Technology

Jul 2025 - Current

Senior Process Engineer (Chemical-Mechanical Planarisation) at Micron Technology

Feb 2018 - Dec 2021

Process Engineer (RDA - Real-time Defect Analysis) at Micron Technology

Aug 2015 - Feb 2018

Research Intern at National University of Singapore

May 2013 - Aug 2013

Jasper started working in 2013, then the employee has changed 1 company and 3 jobs. On average, Jasper works for one company for 1 year 11 months.

Jasper is proficient in Chinese (Simplified) and English. Their professional focus is Data Analysis, Fault Analysis, and Fault Management across 3 core areas.

Education

Bachelor of Engineering (B.Eng.) at National University of Singapore

St. Andrew's Junior College

Swiss Cottage Secondary School

Jasper Namesakes

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Jasper
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Jasper
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Jasper
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