Position:
Product Engineering Intern at Microchip Technology Inc.
Location:
Bend, Oregon, United States
Found email addresses for Jacob Smith:
Found phones for Jacob Smith:
Nov 2025 - Current
Dec 2024 - Current
Mar 2022 - Current
Sep 2024 - Dec 2024
Apr 2024 - Apr 2025
Jan 2023 - Sep 2023
Their professional focus is Analytical Skills, AutoCAD, and Creativity and Innovation across 3 core areas.
Bachelor of Engineering - BE at Oregon State University-Cascades
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