Current Position:
R&D Packaging Engineer at Intel CorporationExperience:
8 yearsLocation:
Hillsboro, OregonApr 2024 - Current
Sep 2023 - Jul 2024
Oct 2022 - May 2023
Aug 2022 - Nov 2022
Oct 2021 - Oct 2022
Jan 2020 - Jul 2021
Jun 2019 - Aug 2020
Jun 2019 - Jul 2019
Jun 2019 - Jun 2019
Jun 2018 - Jul 2018
Jun 2017 - Jul 2017
Master of Science - MS at Arizona State University
Bachelor's degree at Pandit Deendayal Petroleum University, Gandhi Nagar
Name: Intel Corporation
Speciality: Semiconductor design and manufacturing, Artificial intelligence, Autonomous driving, Non-volatile memory solutions
Location: Santa Clara, California, United States
Employees: 10000+
Description: Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside,...
How long has Harsh Verma been working as a R&D Packaging Engineer?
Harsh Verma's total experience in various companies as a R&D Packaging Engineer 1 year 5 months.What is Harsh Verma's average duration of employment for different companies?
On average, Harsh Verma works for one company for 7 monthsWhat industries has Harsh Verma worked in?
Harsh Verma works in the Semiconductors. Previously, Harsh Verma worked in the Hospital & Health Care, and Higher Education, and Industrial Automation, and Oil & Energy.What positions has Harsh Verma held before?
Previously, Harsh Verma worked as a Mechanical Engineer, and Engineer (R&D), and Clean Rooms Lab, and Senior Engineer, and Placement Coordinator.How do I contact Harsh Verma?
Harsh Verma's email address is v********h@intel.com, phone number is +1-***-***-5162. Sign up to get contact details.Who is the CEO of the Intel Corporation?
The CEO of the Intel Corporation is Patrick P. GelsingerWho are Harsh Verma's peers at other companies?
Harsh Verma's peers at other companies are Katelyn Fedrigon and Natalie Liening and Clay ArringtonFind email for 850M+ professionals