H

Harsh Verma's
email & phone

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Current Position:

R&D Packaging Engineer at Intel Corporation

Experience:

8 years

Location:

Hillsboro, Oregon

How to contact Harsh Verma

Last updated:2025-08-14
emailv********h@intel.com
phone+1-***-***-5162
LinkedIn
GitHub
Skype

Analytics

According to LinkedIn Harsh Verma started working on 2017, then the employee has changed 8 companies and 8 jobs. On average, Harsh Verma works for one company for 8 months. Harsh Verma has been working as a R&D Packaging Engineer for Intel Corporation for 518 days. If you are interested in this candidate, contact him directly by using contact details provided by SignalHire.

Work Experience

R&D Packaging Engineer at Intel Corporation

Apr 2024 - Current

Mechanical Engineer at Manrex Ltd.

Sep 2023 - Jul 2024

Engineer (R&D) at Manufacturing Innovations Lab

Oct 2022 - May 2023

Clean Rooms Lab at Manufacturing Innovations Lab

Aug 2022 - Nov 2022

Engineer (R&D) at Manufacturing Innovations Lab

Oct 2021 - Oct 2022

Senior Engineer at CN International Private Limited

Jan 2020 - Jul 2021

Placement Coordinator at Pandit Deendayal Energy University

Jun 2019 - Aug 2020

Mechanical Engineering Intern at Bosch Rexroth

Jun 2019 - Jul 2019

Intern at Oil and Natural Gas Corporation Ltd

Jun 2019 - Jun 2019

Mechanical Engineering Intern at SOMIC ZF Components Pvt Ltd

Jun 2018 - Jul 2018

Project Intern at Shree Hari Vanshi Education Trust - Rural Internship and Civic & Social

Jun 2017 - Jul 2017

Education

Master of Science - MS at Arizona State University

Bachelor's degree at Pandit Deendayal Petroleum University, Gandhi Nagar

Current Company Information Intel Corporation

Name: Intel Corporation

Speciality: Semiconductor design and manufacturing, Artificial intelligence, Autonomous driving, Non-volatile memory solutions

Location: Santa Clara, California, United States

Employees: 10000+

Description: Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside,...

Frequently Asked Questions

How long has Harsh Verma been working as a R&D Packaging Engineer?

Harsh Verma's total experience in various companies as a R&D Packaging Engineer 1 year 5 months.

What is Harsh Verma's average duration of employment for different companies?

On average, Harsh Verma works for one company for 7 months

What industries has Harsh Verma worked in?

Harsh Verma works in the Semiconductors. Previously, Harsh Verma worked in the Hospital & Health Care, and Higher Education, and Industrial Automation, and Oil & Energy.

What positions has Harsh Verma held before?

Previously, Harsh Verma worked as a Mechanical Engineer, and Engineer (R&D), and Clean Rooms Lab, and Senior Engineer, and Placement Coordinator.

How do I contact Harsh Verma?

Harsh Verma's email address is v********h@intel.com, phone number is +1-***-***-5162. Sign up to get contact details.

Who is the CEO of the Intel Corporation?

The CEO of the Intel Corporation is Patrick P. Gelsinger

Who are Harsh Verma's peers at other companies?

Harsh Verma's peers at other companies are Katelyn Fedrigon and Natalie Liening and Clay Arrington
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Harsh Verma Namesakes

Name
Company
Position
H
Gch hospital
Registered Nurse
H
HighFalutin LLC
Account Manager
H
Oscar Shipping Agencies Pvt. Ltd.
Director
H
One Way Link Popularity
Director
H
Hot Pro Engineers
Owner
H
Biocare Associates
Operations Manager
H
Radisson Blu Kaushambi Delhi NCR
Sales Executive
H
KRISHNA SHOES
Sales Executive
H
MSKG BUILDCON PVT LTD
Assistant Manager
H
Dawawala.shop
Founder
H
Command Ads - Performance Marketing Agency
Founder

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