Position:
Advanced Packaging & Heterogeneous Integration undergraduate researcher at Birck Nanotechnology Center (BNC)
Location:
United States
Found email addresses for Harrison:
Found phone for Harrison:
Prospect analytics
Aug 2026 - Current
Oct 2026 - Current
Jan 2026 - Aug 2026
Jun 2026 - Aug 2026
Jul 2025 - Aug 2025
May 2025 - May 2025
Harrison is proficient in Chinese, English, and Korean. Their professional focus is 2.5D Packaging, 3D Packaging, and ARM Cortex-M across 3 core areas.
Harrison holds Advanced Semiconductor Packaging, Semiconductor Fabrication 101, and Timing Analysis for Altera® FPGAs Certification certifications.
Master of Engineering - MEng at Purdue University
Bachelor of Science at Purdue University
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