Current Position:
Package R&D Engineer at Intel CorporationExperience:
12 yearsLocation:
Hsinchu City, TaiwanSep 2021 - Current
May 2018 - Sep 2021
Aug 2016 - May 2018
Jul 2013 - Jun 2016
Jan 2015 - Dec 2015
Doctor of Philosophy - PhD at National Chiao Tung University
Master's degree at National Chiao Tung University
Bachelor's degree at National Chiao Tung University
How long has Han wen Lin been working as a Package R&D Engineer?
Han wen Lin's total experience in various companies as a Package R&D Engineer 3 years 11 months.What is Han wen Lin's minimum period of employment in the companies?
Han wen Lin's minimum period of employment in various companies is 11 months.What is Han wen Lin's average duration of employment for different companies?
On average, Han wen Lin works for one company for 2 years 3 monthsWhat industries has Han wen Lin worked in?
Han wen Lin works in the Semiconductors. Previously, Han wen Lin worked in the Higher Education, and Research.What positions has Han wen Lin held before?
Previously, Han wen Lin worked as a Principal Engineer, and Senior Engineer, and Postdoctoral Researcher, and Visiting Scholar.How do I contact Han wen Lin?
Han wen Lin's email address is w****n@intel.com, phone number is +886-***-***-4898. Sign up to get contact details.Who is the CEO of the Intel Corporation?
The CEO of the Intel Corporation is Patrick P. GelsingerFind email for 850M+ professionals