Position:
Hardware Engineer - Process Development and SIP Assembly Engineer at Broadcom
Location:
South San Francisco, California, United States
Found email addresses for Gordon Chong:
Found phones for Gordon Chong:
Oct 2024 - Current
Aug 2021 - Nov 2023
Their professional focus is 3D Printing, Arduino, and AutoCAD across 3 core areas.
Bachelor of Science - BS at University of California, Davis
College of San Mateo
Skyline College
Burton (Phillip and Sala) Academic High School
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