Current Position:
Packaging Design Lead at QualcommExperience:
15 yearsLocation:
United StatesOct 2021 - Current
Aug 2020 - Oct 2021
Jun 2015 - Aug 2020
Apr 2015 - Jun 2015
Aug 2012 - Jul 2013
Feb 2011 - Aug 2011
Jun 2010 - Jun 2010
Jun 2010 - Jun 2010
Name: Qualcomm
Speciality: Semiconductors, Wireless, Mobile, Networking, Wi-Fi, Small Cells, Wireless Power, Augmented Reality, Location Services, Internet of Things, Automotive, 5G, PC computing, Bluetooth
Location: San Diego, CA, United States
Employees: 10000+
Description: Delivering intelligent computing everywhere....
How long has Divya been working as a Packaging Design Lead?
Divya's total experience in various companies as a Packaging Design Lead 3 years 10 months.What is Divya's average duration of employment for different companies?
On average, Divya works for one company for 1 year 2 monthsWhat industries has Divya worked in?
Divya works in the Telecommunications. Previously, Divya worked in the Semiconductors, and Information Technology and Services, and Electrical/Electronic Manufacturing.What positions has Divya held before?
Previously, Divya worked as a Senior Packaging Engineer, and IC Package Design Engineer at Intel Corporation, and IC Design and Test Engineering Intern, and Assistant System Engineer-Trainee, and Intern.How do I contact Divya?
Divya's email address is -****a@qualcomm.com, phone number is +1-***-***-4565. Sign up to get contact details.Who is the CEO of the Qualcomm?
The CEO of the Qualcomm is Cristiano AmonWho are Divya's peers at other companies?
Divya's peers at other companies are Gracie Bentley and Mayank SinghFind email for 850M+ professionals