Current Position:
Back End PWF Thining Equipment Engineer at Micron TechnologyExperience:
14 yearsLocation:
New Taipei City, New Taipei CityFeb 2025 - Current
Aug 2022 - Sep 2023
Oct 2018 - Feb 2022
Feb 2018 - Oct 2018
Dec 2016 - Feb 2018
Apr 2011 - Dec 2016
學士 at 國立虎尾科技大學
Name: Micron Technology
Speciality: Semiconductor, DRAM, NOR Flash, NAND Flash, SSD, Hybrid Memory Cube, Multichip Packages, Memory Solutions
Location: Boise, Idaho, United States
Employees: 10000+
Description: Micron manufactures DRAM components and modules and NAND Flash. For more than 30 years, Micron’s teams of dreamers, visionaries, and scientists have redefined innovation—design...
How long has Dingjie Hsu been working as a Back End PWF Thining Equipment Engineer?
Dingjie Hsu's total experience in various companies as a Back End PWF Thining Equipment Engineer 7 months.What is Dingjie Hsu's minimum period of employment in the companies?
Dingjie Hsu's minimum period of employment in various companies is 8 months.What is Dingjie Hsu's average duration of employment for different companies?
On average, Dingjie Hsu works for one company for 2 years 5 monthsWhat industries has Dingjie Hsu worked in?
Dingjie Hsu works in the Semiconductors.What positions has Dingjie Hsu held before?
Previously, Dingjie Hsu worked as a Senior Equipment Engineer, and Front End Senior Equipment Engineer, and Shift Lead, and Technical Engineer, and Senior Engineer.How do I contact Dingjie Hsu?
Dingjie Hsu's email address is h**@micron.com, phone number is +886-***-***-9044. Sign up to get contact details.Who is the President & CEO of the Micron Technology?
The President & CEO of the Micron Technology is Sanjay MehrotraFind email for 850M+ professionals