
Position:
Process Engineer at Clopay Corporation
Location:
Dayton, Ohio, United States
Found email addresses for Daniel Hogsed:
Found phone for Daniel Hogsed:
May 2025 - Current
Aug 2024 - May 2025
May 2024 - Aug 2024
May 2021 - Aug 2024
Aug 2023 - May 2024
Their professional focus is 3D Printing, Autodesk Fusion 360, and Bill of Materials across 3 core areas.
Daniel holds Certified SOLIDWORKS Professional, sUAS Remote Pilot License, and NAR High-Power Rocketry Class 1 Certification certifications.
Bachelor of Science - BS at Cedarville University
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