Anupriya

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Module Development Engineer: Packaging at Intel|Hillsboro, Oregon, United States

Position:

Module Development Engineer: Packaging at Intel

Location:

Hillsboro, Oregon, United States

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Last updated: 2024-12-10
Updated: 2024-12-10

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Work Experience 18 years

Module Development Engineer: Packaging at Intel

Jun 2023 - Current

TD Module and Integration Yield Engineer at Intel

Mar 2018 - Jun 2023

Postdoctoral Research Fellow at Brigham Young University

Sep 2016 - Feb 2018

Research Assistant at Brigham Young University

Jun 2016 - Aug 2016

Graduate Research Assistant at Brigham Young University

Aug 2013 - Jun 2016

Teaching Assistant at Brigham Young University

Aug 2010 - Aug 2013

Graduate Research Assistant at Delhi University

Aug 2008 - Aug 2010

Anupriya started working in 2008, then the employee has changed 2 companies and 5 jobs. On average, Anupriya works for one company for 2 years 6 months.

Education

Doctor of Philosophy (Ph.D.) at Brigham Young University

Skills

Medicinal Chemistry, UV/Vis, Scientific Writing, HPLC, GC-MS, Microsoft Office, Pharmaceutical Industry, High-Performance Liquid Chromatography (HPLC), Life Sciences, Chemistry

Frequently Asked Questions

What is Anupriya's minimum period of employment in the companies?

Anupriya's minimum period of employment in various companies is 2 months.

What is Anupriya's average duration of employment for different companies?

On average, Anupriya works for one company for 2 years 5 months

What industries has Anupriya worked in?

Anupriya works in the Semiconductors. Previously, Anupriya worked in the Higher Education.

What positions has Anupriya held before?

Previously, Anupriya worked as a TD Module and Integration Yield Engineer, and Postdoctoral Research Fellow, and Research Assistant, and Graduate Research Assistant, and Teaching Assistant.

How do I contact Anupriya?

Anupriya's phone number is +1-909-***-**86. Sign up to get contact details.

Who is the CEO of the Intel?

The CEO of the Intel is Patrick P. Gelsinger

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