Angelo Espina: Email & Phone Number

Opt-Out

Package/ Process Development Team Lead - HBM at Micron Technology|Hsinchu City, Taiwan

Position:

Package/ Process Development Team Lead - HBM at Micron Technology

Location:

Hsinchu City, Taiwan

View Angelo Espina's Email

Up to 10 free lookups. No credit card required.

Last updated: 2026-01-04

Updated: 2026-01-04

Found email addresses for Angelo Espina:

Business emails:

e**@micron.com

Found phone for Angelo Espina:

+886-***-***-1611

A different Angelo Espina?

Work Experience 30 years

Package/ Process Development Team Lead - HBM at Micron Technology

Jan 2019 - Current

Principal Engineer -Advanced Package Technology Development at Micron Technology

Nov 2017 - Dec 2018

Department Manager at Amkor Technology, Inc.

Apr 2014 - Oct 2017

Principal Engineer - WLCSP at Amkor Technology, Inc.

Apr 2014 - Oct 2015

CEI at ASE Global

Jan 2013 - Jan 2014

Engineering Manager at PSI Technologies

Jan 2009 - Jan 2012

Staff Engineer at Amkor Technology, Inc.

Jul 1996 - Aug 2008

Angelo Espina started working in 1996, then the employee has changed 3 companies and 6 jobs. On average, Angelo Espina works for one company for 4 years 3 months.

Their professional focus is Design of Experiments, DMAIC, and Engineering Management across 3 core areas.

Education

Bachelor's degree at Mapúa University

Master of Business Administration, Academic Units at De La Salle University

Frequently Asked Questions

What is Angelo Espina's email address?

SignalHire found a verified business email address for Angelo Espina: e**@micron.com.

What is Angelo Espina's phone number?

SignalHire found a verified phone number for Angelo Espina: +886-***-***-1611.

How do I contact Angelo Espina at Micron Technology?

You can reach Angelo Espina through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.

What is Angelo Espina's professional background?

Angelo Espina has 30 years of professional experience. They have held roles including Principal Engineer -Advanced Package Technology Development, Department Manager, and Principal Engineer - WLCSP at companies such as Micron Technology, Amkor Technology, Inc., and Amkor Technology, Inc.. Their education includes Bachelor's degree from Mapúa University, and Master of Business Administration, Academic Units from De La Salle University.

Is Angelo Espina's contact information up to date?

Yes. Angelo Espina's SignalHire profile was last updated on 4 January 2026, reflecting their current position as Package/ Process Development Team Lead - HBM at Micron Technology in Boise, Idaho, United States.

Other employees at Micron Technology

Name

Company

Position

Soosung Park

Micron Technology

Senior Field Application Engineer

Get contacts

Danni Du

Micron Technology

RDA Engineer-DRAM

Get contacts

TAEJIN HWANG

Micron Technology

Principal Engineer

Get contacts

Denis Fu

Micron Technology

Sr. Product Development Engineer

Get contacts

Edgar Gerardo Flores Padilla

Micron Technology

Layout Engineer

Get contacts

Jingwei Chen

Micron Technology

Staff Engineer

Get contacts

Cyril Aoun

Micron Technology

Process Equipment Engineer

Get contacts

HONGZHI YANG

Micron Technology

EUV Lithography Equipment Engineer

Get contacts

Jorge Alberto Sanchez Perez

Micron Technology

Global Quality Staff Program Manager

Get contacts

Francisco Javier Mesalles

Micron Technology

Semiconductor Design Engineer

Get contacts

See more profiles

Data Privacy

GDPR COMPLIANT

SignalHire complies with the General Data Protection Regulation (GDPR). SignalHire follows GDPR requirements, including but not limited to rights of data subjects to access, correct, or delete their personal information and supports the right to be forgotten.

CCPA COMPLIANT

SignalHire is CCPA-compliant and provides California residents the right to know, access, opt out, and request deletion of their personal data.