

Chipbond Technology Corporation. Information
Summary
Chipbond Technology Corporation. is a private company. The company currently specializes in the Electrical/Electronic Manufacturing area. The Chipbond Technology Corporation. annual revenue is estimated at < 1M. To connect with Chipbond Technology Corporation. employee register on SignalHire.
Industries | |
Headquarters Location | 力行五路3號, 新竹市東區科學園區, 300 TW |
Employees Size | 5000-10000 employees |
Specialties | 金凸塊(Gold Bump), 錫鉛凸塊(Solder Bump), 捲帶式軟板封裝(Tape Carrier Packaging), 捲帶式薄膜覆晶(Chip On Film), 玻璃覆晶封裝(Chip On Glass), 覆晶(chipBGA TM), 邏輯IC(logic IC) |
Founded | 1997 |
Operating Status | Independent Company |
Employees Turnover 4 quarter 2025
Number of employees switched from or switched to
Length of Employment
Employee tenure at Chipbond Technology Corporation. shows a diverse range of experience levels:
3% have been with the company for less than 1 year4% for 1–2 years10% for 3–4 years30% for 5–7 years13% for 8–10 years39% have over 11 years of service at Chipbond Technology Corporation.Ex-employees positions
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