Chipbond Technology Corporation.
Chipbond Technology Corporation.

Chipbond Technology Corporation. Information

Contact top employees from Chipbond Technology Corporation.

Summary

Chipbond Technology Corporation. is a private company. The company currently specializes in the Electrical/Electronic Manufacturing area. The Chipbond Technology Corporation. annual revenue is estimated at < 1M. To connect with Chipbond Technology Corporation. employee register on SignalHire.

Industries

Headquarters Location

力行五路3號, 新竹市東區科學園區, 300 TW

Employees Size

5000-10000 employees

Specialties

金凸塊(Gold Bump), 錫鉛凸塊(Solder Bump), 捲帶式軟板封裝(Tape Carrier Packaging), 捲帶式薄膜覆晶(Chip On Film), 玻璃覆晶封裝(Chip On Glass), 覆晶(chipBGA TM), 邏輯IC(logic IC)

Founded

1997

Operating Status

Independent Company

Employees Turnover 4 quarter 2025

Number of employees switched from or switched to
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Total number all of employee turnover
Number of employees by department
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Total number all of employee turnover
Length of Employment
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Employee tenure at Chipbond Technology Corporation. shows a diverse range of experience levels:
3% have been with the company for less than 1 year4% for 1–2 years10% for 3–4 years30% for 5–7 years13% for 8–10 years39% have over 11 years of service at Chipbond Technology Corporation.
Ex-employees positions
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Contact top employees from Chipbond Technology Corporation.
pamela melendres
Inspection Coordinator
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Bernard Bryan Tanguamos
Technical Assistance Specialist
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Jimmy Cheng
Senior Software Engineer
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Shuchi Yang
Procurement Supervisor Officer
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Jane Foo
Senior Engineer
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Xuan Cheng Low
Equipment Engineer
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Evon Chang
Senior officer at Management Center
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Louis Tsai
Sales Engineer
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Joemar Reyes
Technical Assistant
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Danial Imran
Equipment Engineer
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Allan Carl Trinidad
Technical Assistant
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Thanesh Mariappan
Equipment Engineer
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Izat imran
Equipment Engineer
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Chia Chin Cai
Production Engineer
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YuChi Hu
Customer Quality Service Engineer
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Mar Jurine Daoa
Technical Assistant
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JinXiang Zou
Software Engineer
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Wei Tan
Product Planner
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Ethan Lee
Senior Deputy Manager
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Merci Yao
Senior Product Engineer
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Renyu Hsu
Product Customer Engineer
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Bing Yi Chang
Process Engineer
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Hsiang Pin Hou
Supervisor engineer
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KERVEY CAJES
Technical Assistant
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Sandy Lee
Production Planning Engineer
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Andrea Peng
Senior Sales Engineer
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FAQ

The headquarters of Chipbond Technology Corporation. are located in 新竹市東區科學園區, Taiwan.
Chipbond Technology Corporation. currently employs 5000-10000 people.
Chipbond Technology Corporation.'s revenue is approximately < 1M.

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