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STATS ChipPAC Ltd.

STATS ChipPAC Ltd.

STATS ChipPAC provides innovative packaging and test solutions for semiconductor companies in well-established markets such as communications, consumer and computing as well as emerging markets in automotive electronics, Internet of Things (IoT) and wearable devices. With over 20 years of experience as a leading Outsourced Semiconductor Assembly and Test (OSAT) provider, we are able to offer our customers innovative, cost effective solutions that deliver higher performance, functionality and processing speeds with a significant reduction in space in an electronics device.
Headquarters
Singapore
Company size
10,001+ employees
Specialties
Semiconductor Packaging, Semiconductor Testing, Semiconductor Package Design, Semiconductor Wafer Bumping, IC Test, Wafer Bumping, Wafer Level Packaging, System-in-Package, Flip Chip, MEMS and Sensors, Integrated Passive Devices, Wirebond, eWLB, Package-on-Package, FOWLP, WLCSP
Top employees at
STATS ChipPAC Ltd.
F
Frederick Santos
Senior System Integrator Engineer
Shanghai City, China
L
Lyndon Cablao
Staff Engineer, MTS
Singapore
F
Fengli Liu
• Process Engineer
Singapore
A
Ashutosh Tripathi
Associate Process Engineer
Singapore
N
Noel Plaza
Senior CIM Engineer
Singapore

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The most popular email templates:
STATS ChipPAC Ltd.’s email formatsPercentage
lastName_firstNameInitialdoe_j@statschippac.com78%
firstName-lastNamejane-doe@statschippac.com79%
firstNamelastNamejanedoe@statschippac.com90%
firstNameInitial-lastNamej-doe@statschippac.com59%
lastNameInitialfirstNameInitialdj@statschippac.com94%
firstNameInitial_lastNameInitialj_d@statschippac.com68%

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