Position:
Senior, IC package Process & manufacture Engineer at QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.
Location:
Taiwan
Found email addresses for Wang Jin:
Found phone for Wang Jin:
Dec 2021 - Current
Aug 2021 - Dec 2021
Jul 2017 - Aug 2021
May 2016 - Jun 2017
Aug 2012 - Sep 2015
Sep 2012 - Feb 2013
Jun 2000 - Sep 2000
Their professional focus is Chemical Engineering,Electronic Packaging, Phase Transfer,Material Engineering, ELK analysis, and ESD control across 3 core areas.
Master's degree at National Chung Hsing University
What is Wang Jin's email address?
SignalHire found a verified business email address for Wang Jin: w***n@qualcomm.com.What is Wang Jin's phone number?
SignalHire found a verified phone number for Wang Jin: +886-***-***-0085.How do I contact Wang Jin at QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.?
You can reach Wang Jin through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.What is Wang Jin's professional background?
Wang Jin has 26 years of professional experience. They have held roles including Subcon managemt, section manager, SQE, senior engineer, and SQE, senior engineer at companies such as S-group of Foxconn, 群聯電子 PHISON Electronics, and Winbond. Their education includes Master's degree from National Chung Hsing University.Is Wang Jin's contact information up to date?
Yes. Wang Jin's SignalHire profile was last updated on 28 April 2026, reflecting their current position as Senior, IC package Process & manufacture Engineer at QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD. in CAMBRIDGE, United Kingdom.SignalHire complies with the General Data Protection Regulation (GDPR). SignalHire follows GDPR requirements, including but not limited to rights of data subjects to access, correct, or delete their personal information and supports the right to be forgotten.
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