Simon Ma

Simon Ma: Email & Phone Number

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Director, Advanced Packaging Technology & System Integration Program at TSMC|San Jose, California, United States

Position:

Director, Advanced Packaging Technology & System Integration Program at TSMC

Location:

San Jose, California, United States

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Last updated: 2025-02-18
Updated: 2025-02-18

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Work Experience 23 years

Director, Advanced Packaging Technology & System Integration Program at TSMC

Apr 2018 - Current

Senior Engineer Manager at Medtronic

Oct 2014 - Mar 2018

Second level R&D Process Development Engineering Manager at Intel

Feb 2007 - Aug 2014

Senior Process Engineer at Intel

Jul 2003 - Jan 2007

Simon Ma started working in 2003, then the employee has changed 2 companies and 3 jobs. On average, Simon Ma works for one company for 5 years 8 months.

Their professional focus is Cross-functional Team Leadership, Design for Manufacturing, and Electronics Packaging across 3 core areas.

Education

Ph.D. at University of Michigan

B.S., M.S. at Tsinghua University

Frequently Asked Questions

What is Simon Ma's email address?

SignalHire found a verified business email address for Simon Ma: m**@tsmc.com.

What is Simon Ma's phone number?

SignalHire found a verified phone number for Simon Ma: +1-***-***-5140.

How do I contact Simon Ma at TSMC?

You can reach Simon Ma through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.

What is Simon Ma's professional background?

Simon Ma has 23 years of professional experience. They have held roles including Senior Engineer Manager, Second level R&D Process Development Engineering Manager, and Senior Process Engineer at companies such as Medtronic, Intel, and Intel. Their education includes Ph.D. from University of Michigan, and B.S., M.S. from Tsinghua University.

Is Simon Ma's contact information up to date?

Yes. Simon Ma's SignalHire profile was last updated on 18 February 2025, reflecting their current position as Director, Advanced Packaging Technology & System Integration Program at TSMC in Hsinchu, Taiwan, Taiwan.

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