Ryan Pole

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R&D Advanced Packaging Engineer - Laser Singulation at Intel|Hillsboro, Oregon, United States

Position:

R&D Advanced Packaging Engineer - Laser Singulation at Intel

Location:

Hillsboro, Oregon, United States

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Last updated: 2026-05-04
Updated: 2026-05-04

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Work Experience 11 years

R&D Advanced Packaging Engineer - Laser Singulation at Intel

Oct 2024 - Current

Graduate Technical Intern at Intel

Jan 2024 - Sep 2024

Physics Peer Learning Assistant at University of Oregon

Jan 2022 - Apr 2023

Physics Research Assistant - Wang Lab at University of Oregon

Jun 2022 - Sep 2022

Electricians Assistant at 49Er Electric

Jun 2021 - Oct 2022

Back Waiter and Host at West River Hospitality Group

Jun 2018 - Oct 2019

Assistant Ski Coach at Palisades Tahoe

Dec 2015 - May 2018

Education

Master of Science - MS at University of Oregon

Bachelor's degree at University of Oregon

Frequently Asked Questions

What is Ryan Pole's email address?

SignalHire found a verified business email address for Ryan Pole: p******n@intel.com.

What is Ryan Pole's phone number?

SignalHire found a verified phone number for Ryan Pole: +1-***-***-5730.

How do I contact Ryan Pole at Intel?

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What is Ryan Pole's professional background?

Ryan Pole has 11 years of professional experience. They have held roles including Graduate Technical Intern, Physics Peer Learning Assistant, and Physics Research Assistant - Wang Lab at companies such as Intel, University of Oregon, and University of Oregon. Their education includes Master of Science - MS from University of Oregon, and Bachelor's degree from University of Oregon.

Is Ryan Pole's contact information up to date?

Yes. Ryan Pole's SignalHire profile was last updated on 4 May 2026, reflecting their current position as R&D Advanced Packaging Engineer - Laser Singulation at Intel in Santa Clara, California, United States.

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