Ryan Dorofy

Ryan Dorofy: Email & Phone Number

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Process Engineering Intern at Packaging Corporation of America|Philadelphia, Pennsylvania, United States

Position:

Process Engineering Intern at Packaging Corporation of America

Location:

Philadelphia, Pennsylvania, United States

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Last updated: 2026-05-24
Updated: 2026-05-24

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Work Experience 5 years

Process Engineering Intern at Packaging Corporation of America

May 2026 - Current

Recovery Process Engineering Intern at Smurfit Westrock

Aug 2025 - Dec 2025

Engineering Intern at Impact Guard

May 2025 - Aug 2025

Student Assistant Manager at Virginia Tech Dining Services

Mar 2024 - May 2025

Porter at Cannstaters Volkfest Verein

Jun 2021 - Aug 2024

Ryan Dorofy started working in 2021, then the employee has changed 4 companies and 4 jobs. On average, Ryan Dorofy works for one company for 1 year.

Their professional focus is Food and Beverage Operations, Food Preparation, and Food Safety across 3 core areas.

Education

Bachelor of Science at Virginia Tech

Frequently Asked Questions

What is Ryan Dorofy's email address?

SignalHire found a verified business email address for Ryan Dorofy: d**@packagingcorp.com.

What is Ryan Dorofy's phone number?

SignalHire found a verified phone number for Ryan Dorofy: +1-***-***-8879.

How do I contact Ryan Dorofy at Packaging Corporation of America?

You can reach Ryan Dorofy through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.

What is Ryan Dorofy's professional background?

Ryan Dorofy has 5 years of professional experience. They have held roles including Recovery Process Engineering Intern, Engineering Intern, and Student Assistant Manager at companies such as Smurfit Westrock, Impact Guard, and Virginia Tech Dining Services. Their education includes Bachelor of Science from Virginia Tech.

Is Ryan Dorofy's contact information up to date?

Yes. Ryan Dorofy's SignalHire profile was last updated on 24 May 2026, reflecting their current position as Process Engineering Intern at Packaging Corporation of America in Lake Forest, Illinois, United States.

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