Position:
Principal Engineer - Chip Package Interaction at Allegro MicroSystems
Location:
Clifton Park, New York, United States
Found email addresses for Prem CS:
Found phones for Prem CS:
Jan 2021 - Current
Jan 2012 - Dec 2020
Mar 2010 - Dec 2011
Dec 1998 - Feb 2010
Their professional focus is Advanced Wafer-Level Packaging, AEC-Q100 Qualification, and Automotive Semiconductor Packaging across 3 core areas.
Prem holds Six Sigma: Green Belt certifications.
Master of Engineering (M.Eng.) at Indian Institute of Technology, Madras
Master of Science - MSPhysics at University of Kerala, Thiruvananthapuram
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