Position:
Process Engineer(Bumping) at Chipbond Technology Malaysia
Location:
Kulim District, Kedah, Malaysia
Found email addresses for Muhammad Akmal:
Found phone for Muhammad Akmal:
Jun 2026 - Current
Sep 2022 - May 2026
Mar 2022 - Jul 2022
Their professional focus is Automation, Cost Control, and Customer Service across 3 core areas.
Food Biotechnology at Universiti Sains Islam Malaysia
Foundation degree at Universiti Sains Islam Malaysia
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