Position:
Package Development Engineer - Core Engineering Modules, NPI at Micron Technology
Location:
Johore, Malaysia
Found email addresses for Ling Luo Ing:
Found phone for Ling Luo Ing:
Aug 2022 - Current
Jul 2021 - Oct 2021
Dec 2016 - Aug 2017
Their professional focus is AutoCAD, Communication, and JMP across 3 core areas.
Bachelor's degree at Universiti Teknologi Malaysia
STPM at SMK ROSLI DHOBY
SPM at SMK DURIN
What is Ling Luo Ing's email address?
SignalHire found a verified business email address for Ling Luo Ing: l**@micron.com.What is Ling Luo Ing's phone number?
SignalHire found a verified phone number for Ling Luo Ing: +60-***-***-8133.How do I contact Ling Luo Ing at Micron Technology?
You can reach Ling Luo Ing through SignalHire by unlocking their verified email and direct phone number (free signup, no credit card needed). SignalHire is the fastest route if you need their contact details immediately.What is Ling Luo Ing's professional background?
Ling Luo Ing has 10 years of professional experience. They have held roles including Research Assistant, and Finance Executive at companies such as Procid Sdn Bhd, and Sing Kwong Supermarket, Sibu. Their education includes Bachelor's degree from Universiti Teknologi Malaysia, and STPM from SMK ROSLI DHOBY.Is Ling Luo Ing's contact information up to date?
Yes. Ling Luo Ing's SignalHire profile was last updated on 27 April 2026, reflecting their current position as Package Development Engineer - Core Engineering Modules, NPI at Micron Technology in Boise, Idaho, United States.SignalHire complies with the General Data Protection Regulation (GDPR). SignalHire follows GDPR requirements, including but not limited to rights of data subjects to access, correct, or delete their personal information and supports the right to be forgotten.
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