Ethan Chen

Ethan Chen: Email & Phone Number

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Director of Advanced Packaging at Qualcomm|United States

Position:

Director of Advanced Packaging at Qualcomm

Location:

United States

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Last updated: 2025-11-05
Updated: 2025-11-05

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Work Experience 22 years

Director of Advanced Packaging at Qualcomm

Jan 2025 - Current

Technical Lead at TSMC Washington

Jan 2023 - Current

Staff Engineer at TSMC Washington

Jan 2019 - Jan 2023

Senior Process Engineer at TSMC Washington

Jan 2016 - Jan 2019

Process Engineer at Intel

Jan 2011 - Jan 2016

Yield Engineer at TSMC Washington

Jan 2008 - Jan 2011

Process Engineer at Sharp Microelectronics of the Americas

Jan 2004 - Jan 2008

Ethan Chen started working in 2004, then the employee has changed 4 companies and 5 jobs. On average, Ethan Chen works for one company for 3 years 5 months.

Their professional focus is Advanced Packaging Technologies(Fan-Out, CoWoS, InFO, EMIB, Hybrid Bonding, 3DIC), Advanced Packaging Technology, and Cost, Yield, and Reliability Optimization across 3 core areas.

Education

Master of Science - MS at University of Washington

Ethan Chen Namesakes

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Company
Position
Ethan Chen
Client Specialist
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Ethan CHEN
Full Stack Engineer
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Ethan Chen
Electrical Engineer
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