Current Position:
Packaging Module Development Engineer at Intel CorporationExperience:
5 yearsLocation:
George Town, Penang, MalaysiaOct 2024 - Current
Feb 2022 - Oct 2024
Feb 2020 - Feb 2022
Master of Engineering - MEng at Brunel University London
A-Level at INTEC Education College
SPM (GCSE equivalent) at Tapah Science School
PMR at SMK Sungai Pusu
Name: Intel Corporation
Speciality: Semiconductor design and manufacturing, Artificial intelligence, Autonomous driving, Non-volatile memory solutions
Location: Santa Clara, California, United States
Employees: 10000+
Description: Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside,...
What is Mohammad Danial Bin Kamarul Zaman's minimum period of employment in the companies?
Mohammad Danial Bin Kamarul Zaman's minimum period of employment in various companies is 2 years.What is Mohammad Danial Bin Kamarul Zaman's average duration of employment for different companies?
On average, Mohammad Danial Bin Kamarul Zaman works for one company for 2 years 4 monthsWhat industries has Mohammad Danial Bin Kamarul Zaman worked in?
Mohammad Danial Bin Kamarul Zaman works in the Semiconductors.What positions has Mohammad Danial Bin Kamarul Zaman held before?
Previously, Mohammad Danial Bin Kamarul Zaman worked as a Wafer Level Assembly Senior Process & Equipment Engineer, and Process and Equipment Engineer.How do I contact Mohammad Danial Bin Kamarul Zaman?
Mohammad Danial Bin Kamarul Zaman's email address is d************d@intel.com, phone number is +60-***-***-5131. Sign up to get contact details.Who is the CEO of the Intel Corporation?
The CEO of the Intel Corporation is Patrick P. GelsingerWho are Mohammad Danial Bin Kamarul Zaman's peers at other companies?
Mohammad Danial Bin Kamarul Zaman's peers at other companies are David Vasquez and Khadija Afreen and AhmedFind email for 850M+ professionals